The New Commutation Technology Research Institute Successfully Holding the First "Yangyan Salons on Chips"

On March 23, the New Commutation Technology Research Institute (hereinafter the "Commutation Institute") successfully hosted the first "Yangyan Salons on Chips" via "online + offline" channels. The first session focused on "Crimping-Type Packaging Technology of High-Voltage and High-Power Semiconductor Devices and Application". The lecture was given by the head of the Commutation Institute, and about 70 professionals from the Commutation Institute, Smart Energy Research Institute, Tsinghua University and other units participated.

Packaging technology is an important technical direction in the research and development of high-voltage and high-power semiconductor devices. The lecturer gave a detailed explanation and analysis from the aspects of typical packaging structures, development history of crimping devices, key technologies of crimping-type packaging, and application practices. After the lecture, online and offline audiences enthusiastically asked questions and actively engaged in discussions. The atmosphere was warm and lively.

"Yangyan Salons on Chips" is a series of academic exchange activities hosted by the Commutation Institute of Huairou Laboratory and held every month. The activities mainly focus on high-voltage and high-power semiconductor chips, devices and application technologies, sharing cutting-edge academic frontiers, scientific research progress, and engineering practices. The activities aim to provide learning and sharing as well as exchange and cooperation opportunities for professionals in the field both inside and outside the Laboratory.